Today, MediaTek has unveiled the Dimensity 9400, the next flagship system-on-chip in its company’s ecosystem. The new chipset appears to arrive as a Dimensity 9300 series sequel and is being launched using a second-generation TSMC 3 nm process technology. It is paired with an all-large core CPU architecture, meant to produce high performance alongside energy efficiency in the next-generation mobile devices.
Efficiency and performance upgrades
The Dimensity 9400 has notable improvements in energy efficiency. According to MediaTek, its chip consumes 40% less power than its previous generation at equal performance. The updated scheduling engine balances performance and energy use in real-time.
CPU: Enhanced core configuration
The Dimensity 9400 incorporates an upgraded CPU architecture, consisting of:
- 1 x ARM Cortex-X925 performance core clocked at 3.62GHz
- 3 x Cortex-X4 performance cores at 3.30GHz
- 4 x Cortex-A720 efficiency cores at 2.4GHz
According to MediaTek, the chip has achieved a single-core and 28% boost in multicore performance as compared to its predecessor. Alongside this, the chip is also capable of using 10.7Gbps LPDDR5X memory as well as Armv9 architecture, promising enhanced cache management along with faster data processing.
GPU: Improved graphics and gaming support
The Dimensity 9400 chip packs a 12-core Immortalis-G925 GPU. According to MediaTek, this enhances peak performance by 41% while reducing power consumption by 44%. In short, it makes Dimensity 9400 an obvious bet for gaming users who intend to enjoy full-frame-rate performance in demanding mobile games.
The chip further supports HyperEngine, a technology developed in collaboration with Arm Accurate Super Resolution. It targets the quality upgrade of images. The Dimensity OMM is said to provide 40% performance improvement over its ray tracing claim, which might ensure better lighting and shadow effects for mobile gaming.
APU: Advancing AI capabilities
The Dimensity 9400’s eighth-generation NPU 890 AI processor improves processing for text, images, and speech. As MediaTek points out, the Agentic AI Engine lets developers create complex AI applications and runs both edge and cloud-based AI models with maximum efficiency. Moreover, the chip supports on-device LoRA training and high-quality video generation.
According to MediaTek, the new chip supports up to 80% faster LLM prompt performance compared to the Dimensity 9300, while also being 35% more power efficient.
Display and imaging capabilities
The Dimensity 9400 supports adaptive HDR display technology. It will get to adjust screen brightness, contrast, and saturation automatically as per the ambient lighting. Also, it supports three-channel display technology, which would let the device manufacturers have the flexibility of screen resolution and refresh rates.
For imaging, the chip integrates MediaTek Imagiq 1090 ISP that supports HDR video recording over the entire zoom range. MediaTek claims that its Smooth Zoom technology is targeted at capturing moving subjects while simultaneously minimizing power usage. The company reports a 14% reduction in power use with video capture at 4K60 compared to the Dimensity 9300.
Connectivity: Faster speeds and extended range
On the connectivity front, the Dimensity 9400 is paired with a new 4 nm Wi-Fi/Bluetooth combo chip that supports data rates of up to 7.3Gbps and boasts a 50% reduction in power consumption. The chipset further supports tri-band concurrent Wi-Fi 7 capabilities, along with MediaTek’s Xtra Range 3.0 technology, which is said to extend Wi-Fi coverage up to 30 meters.
According to MediaTek, Bluetooth will also boast “12Mbps throughput and 384KHz audio transmission”. Another advantage of a new dual Bluetooth fusion BLR technology will be an increase in Bluetooth connection distance to up to 1500 meters.
In terms of Bluetooth, the chip supports 12Mbps throughput and 384KHz audio transmission, MediaTek mentions. The new dual Bluetooth fusion BLR technology can improve the Bluetooth connection distance up to 1500 meters as well.
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MediaTek Dimensity 9400 5G specifications
- Process Technology: TSMC’s second-generation 3 nm process
- CPU: 1x Arm Cortex-X925, 2 MB L2 cache, up to 3.63 GHz, 3x Arm Cortex-X4, 1 MB L2 cache, 4x Arm Cortex-A720, 512 KB L2 cache, 12 MB L3 cache + 10 MB SLC
- Graphics: Arm Immortalis-G925 MC12 GPU
- AI Processing: MediaTek NPU 890 (Generative AI, Agentic AI)
- Memory: LPDDR5X 10667 9600Mbps memory up to 10.7Gbps, UFS 4 + MCQ
- Camera: Up to 320MP camera, Imagiq 1090
- Display: WQHD+ at 180Hz, Tri-port MIPI for Tri-Fold Displays
- Connectivity: Wi-Fi 7 (a/b/g/n/ac/ax/be), Triple Band Triple Concurrency (TBTC), Bluetooth 5.4 with dual Bluetooth engine, 12Mbps, 5G/4G Dual SIM Dual Active, Dual, Data, SA & NSA modes, 3GPP-R17, Sub-6GHz (FR1), 2G-5G multimode
- GPS and Navigation: GPS L1CA+L5+L1C, BeiDou B1I+ B1C + B2a + B2b, Glonass L1OF, Galileo E1 + E5a + E5b, QZSS L1CA + L5, NavIC L5
Availability
vivo X200 series will be the world’s first phone to carry the Dimensity 9400, set to launch in China on October 14. Furthermore, MediaTek announced that the Dimensity 9400 SoC will power the OPPO Find X8 series launching on October 24.
